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Inspec Inc. will be launching its latest 3D capture system next week at the National Manufacturing Week tradeshow (McCormick Place convention center in Chicago).

This ne...

Peter Sheerin, Blogger

February 20, 2004

1 Min Read

Inspec Inc. will be launching its latest 3D capture system next week at the National Manufacturing Week tradeshow (McCormick Place convention center in Chicago). This new device combines the capabilities of its 3D Capturor series and the 3D Mega DF System, and will enable customers greater flexibility in the sizes of objects they can scan. The DF in the name stands for Dual Field--the system has two cameras that enable scans to be made of both large and small objects without switching lenses or other cumbersome changes. Pricing was not immediately available.

About the Author(s)

Peter Sheerin

Blogger

Peter Sheerin is the editor of Gamasutra.

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